PCB工程英文確認(rèn)常用詞及常用語句

1、工 程 英 文 確 認(rèn) 常 用 詞 及 常 用 語 句 匯 總厚度公差線路層孔層阻焊層字符層外形層疊層單詞1. 附件：attached 2. 樣品：sample3. 承認(rèn)：approval4. 答復(fù)：answer;reply5. 規(guī)格：spec6. 與.同樣的：the same as 7. 前版本：previous version(old version)8. 生產(chǎn)：production9. 確認(rèn)：confirm10. 再次確認(rèn)：double confirm11. 工程問題：engineering query（EQ）12. 盡快：ASAP(as soon as possible)13. 生產(chǎn)文

2、件：production gerber14. 聯(lián)系某人：contact somebody15. 提交樣板：submit sample16. 交貨期：delivery date17. 電測成本：ET（electrical test） cost18. 通斷測試：Open and short testing19. 參考：reference to20. IPC標(biāo)準(zhǔn)：IPC standard21. IPC二級(jí)：IPC class 222. 可接受的：acceptable23. 允許：permit24. 制造：manufacture25. 修改：revision26. 公差：tolerance27. 忽略

3、：ignore(omit)28. 工具孔：tooling hole29. 安裝孔：mounting hole30. 元件孔：component hole31. 槽孔：slot32. 郵票孔：snap off hole33. 導(dǎo)通孔：via34. 盲孔： blind via35. 埋孔：buried via36. 金屬化孔：PTH(plating through hole)37. 非金屬化孔：NPTH( no plating through hole)38. 孔位：hole location39. 避免：avoid40. 原設(shè)計(jì)：original design41. 修改：modify42. 按

4、原設(shè)計(jì)：leave it as it is43. 附邊：waste tab44. 銅條：copper strip45. 拼板強(qiáng)度：panel strong46. 板厚：board thickness47. 刪除：remove(delete)48. 削銅：shave the copper49. 露銅：copper exposure50. 光標(biāo)點(diǎn)：fiducial mark51. 不同：be different from(differ from)52. 內(nèi)?。篿nside radius53. 焊環(huán)：annular ring54. 單板尺寸：single size55. 拼板尺寸：panel siz

5、e56. 銑：routing57. 銑刀：router58. V-cut：scoring59. 啞光：matt60. 光亮的：glossy61. 錫珠：solder ball(solder plugs)62. 阻焊：solder mask(solder resist)63. 阻焊開窗：solder mask opening64. 單面開窗：single side mask opening65. 補(bǔ)油：touch up solder mask66. 補(bǔ)線：track welds67. 毛刺：burrs68. 去毛刺：deburr69. 鍍層厚度：plating thickness70. 清潔度：

6、cleanliness71. 離子污染：ionic contamination72. 阻燃性：flammability retardant73. 黑化：black oxidation74. 棕化：brown oxidation75. 紅化：red oxidation76. 可焊性：solderability77. 焊料：solder78. 包裝：packaging79. 角標(biāo)：corner mark80. 特性阻抗：characteristic impedance81. 正像：positive82. 負(fù)片：negative83. 鏡像：mirror84. 線寬：conductor width8

7、5. 線距：conductor spacing86. 做樣：build sample87. 按照：as per88. 成品：finished89. 做變更：make the change90. 相類似：similar to91. 規(guī)格：specification92. 下移：shift down93. 垂直地：vertically94. 水平的：horizontally95. 增大：increase96. 縮小：decrease97. 表面處理：Surface Finishing98. 波峰焊：wave solder99. 鉆孔數(shù)據(jù)：drilling date100. 標(biāo)記：Logo101.

8、Ul 標(biāo)記：Ul Marking102. 蝕刻標(biāo)記：etched marking103. 周期：date code104. 翹曲：bow and twist105. 外層：outer layer106. 內(nèi)層：internal layer107. 頂層：top layer108. 底層：bottom layer109. 元件面：component side110. 焊接面：solder side111. 阻焊層：solder mask layer112. 絲印層：legend layer (silkscreen layer or over layer)113. 蘭膠層：peelable SM

9、layer114. 貼片層：paste mask layer115. 碳油層：carbon layer116. 外形層：outline layer(profile layer)117. 白油：white ink118. 綠油：green ink119. 噴錫：hot air leveling (HAL)120. 水金：flash gold121. 插頭鍍金：plated gold edge-board contacts122. 金手指：Gold-finger123. 防氧化：Entek(OSP)124. 沉金：Immersion gold (chem. Gold)125. 沉錫：Immersi

10、on Tin(chem.Tin)126. 沉銀：Immersion Silver (chem. silver)127. 單面板：single sided board128. 雙面板：double sided board129. 多層板：multilayer board130. 剛性板：rigid board131. 撓性板：flexible board132. 剛撓板：flex-rigid board133. 銑：CNC (mill , routing)134. 沖：punching135. 倒角：beveling 136. 倒斜角：chamfer137. 倒圓角：fillet138. 尺寸：

11、dimension139. 材料：material140. 介電常數(shù)：Dielectric constant141. 菲林：film142. 成像：Imaging143. 板鍍：Panel Plating144. 圖鍍：Pattern Plating145. 后清洗：Final Cleaning146. 疊層：layup (stack-up)147. 污染焊盤：contaminate pad148. 分孔圖：drill chart149. 度數(shù)：degree150. 被覆蓋：be covered with151. 負(fù)公差：minus tolerance152. 標(biāo)靶盤： target pad1

12、53. 外形公差：routing tolerance154. 芯板：core155. 超出能力：Beyond our capacity156. 角度：angle157. V-CUT余厚：V-CUT web常用語句、厚度1. 要求孔內(nèi)銅厚0.001太緊對(duì)我們的生產(chǎn)，建議按IPC二級(jí)0.0008。The copper thickness of the wall of the plated-through holes is specified 0.001. Its too tight for our production. We suggest as per IPC class 2.thats to

13、 say ,Its 0.0008 .2.要求金手指鍍金厚度為1.2-1.5um，我們加工太困難，建議按我們常規(guī)0.45um。The plating thickness of Au in edge contact is specified 1.2-1.5um,it is too tough for us, we suggest following our normal standard ,that is to say 0.45um instead.3.建議所要求的銅厚2OZ為成品銅厚，而且我們將用基銅1.5OZ電鍍到2OZ。The copper thickness is specified 2O

14、Z .We suggest the finished copper thickness 2OZ. And we will use the base material with 1.5OZ copper thickness and plate to 2OZ for our production. 4.要求錫厚為0.0005-0.003，我們做不到這么厚，建議按IPC二級(jí)，即保證可焊性，The solder thickness is required to plated 0.0005-0.003 ,We can not reach the requirement .We suggest follo

15、wing IPC class 2 for the solder thickness and we will assure the solderability. 二、公差1. XXX.的尺寸公差為+/-0.005，這要求是太緊對(duì)我們生產(chǎn)，建議公差放松到+/-0.008。The tolerance of dimension is specified XXX.+/-0.005 .It is tight for our production .We suggest +/-0.008 instead。2.在*.pdf文件中要求外形公差為+/-0.005，建議按IPC 二級(jí)+/-0.01代替。The pr

16、ofile tolerance is specified +/-0.005 in *.pdf file. We suggest as per IPC class 2，that is to say, it is +/-0.01.3. 在疊層圖中要求板厚公差為+/-0.007，而notes 1中要求板厚公差為+/-0.005，他們是不同的，建議0.062+/-0.007是可接受的，因?yàn)?/-0.005對(duì)我們來說太難控制了。The tolerance of the board thickness is specified +/-0.007 in layup detail which is diffe

17、rent form NOTES 1 +/-0.005.We suggest 0.062+/-0.007 is acceptable for +/-0.005 is very tough for us to control.4.外形公差要求+/-0.1mm，這超出了我們生產(chǎn)，建議按+/-0.2mm控制。The tolerance of the outline is specified +/-0.1mm.Its above us.We suggest +/-0.2mm instead.5. v-cut留厚公差為+/-0.06mm上下偏移公差為+/-0.05mm，這兩個(gè)公差都太緊，建議兩個(gè)公差都按+

18、/-0.1mm控制。The remain tolerance of v-cut is specified +/-0.06mm and offset tolerance is +/-0.05mm. they are too tight for us,we suggest both tolerance are +/-0.1mm instead.6.孔位公差為0.05mm，這是太緊對(duì)我們，建議用+/-0.076mm替代。The tolerance of the hole position is specified 0.05mm. Its too tight for us, We suggest +/

19、-0.076mm instead.7. 角度公差為+/-0.5mm，這是太緊對(duì)我們，v-cut角度我們將控制在30+/-5度。The tolerance of angle is +/-0.5 degree ,it is tight for us , we would like to control the angle of v-cut within 30+/-5 degree.8.在1MB5476-01.pdf文件中要求孔到板中心的公差是+/-0.05mm，這是太緊對(duì)我們，建議安IPC二級(jí)。It is special that the tolerance of the hole to boar

20、d center is +/-0.05mm in the 1MB5476-01.pdf file,it is too tight for us ,we suggest as per IPC class 2 .9.要求線寬和線間距公差為+/-0.03，這是太緊對(duì)我們，請(qǐng)確認(rèn)放松到+/-20%。It stated that conductor width and spacing shall be within +/-0.03(0.001) of gerber data , it is tight for us , we would like to relax to +/-20%.Pls confi

21、rm.10.3.0的孔徑公差要求+0.05mm，這太緊對(duì)我們，請(qǐng)確認(rèn)放松到+0.1/-0mm。The tolerance of the holes with diameter 3.0mm is required to control within +0.05mm ,it is tight for us , we would like to relax to +0.1/-0mm.Pls confirm.三、線路層1.兩個(gè)孔到外形很近，這將引起露銅和破孔，建議允許露銅與破孔。Two holes are near the outline,it will cause copper exposed an

22、d hole broken,we suggest copper exposed and hole broken is permitable.2.有些盤離外形很近，建議削銅皮0.4mm，避免露銅。Some pads are close to the outline .We suggest shaving the pads about 0.4mm avoid to the copper exposure.3. 焊盤延伸出板外，如按原設(shè)計(jì)，板邊將會(huì)露銅，建議允許露銅。The copper pad extend to the board outline, it will lead to copper

23、exposed if we follow Gerber to do,We suggest copper exposed is acceptable.4.有三個(gè)盤離v-cut 線很近將會(huì)引起露銅，建議削焊盤0.4mm避免露銅。The three pads are so close to the v-cut that they will cause copper exposure. We suggest shaving the pads 0.4mm avoid to the copper exposure.5.底層有些地方線路網(wǎng)格間距僅有0.178mm，這種網(wǎng)格間距我們生產(chǎn)無法做到，建議減小線寬使

24、間距達(dá)到0.2mm.The copper grids on bottom side is only 0.178mm in some places,we can not do it per this gap,so we suggest decreasing the tracewidth to make copper grids to 0.2mm.6. 既然沒有功能上的影響，我們建議所有層附邊均加些銅皮以提高電鍍質(zhì)量。We suggest putting some extra copper on the waste tab in all layers to improve plating qual

25、ity since this is no function effect.7.建議加在頂層空白區(qū)域加些銅以提高電鍍質(zhì)量。We suggest putting some copper in blank area on top side to improve plated quality.8.我們發(fā)現(xiàn)有兩處銅皮間距僅有0.013mm，建議把它們連接起來。We have found that the gap between two block copper is only 0.013mm on bottom side,we suggest they are connected.9. 兩個(gè)光標(biāo)點(diǎn)處在v

26、-cut線上，它們將被削到，我們建議向左邊移1.0mm。The two fiducial marks are over v-groove line . They will be cut . We suggest moving them 1.0mm toward the left . 四、孔層1. 兩個(gè)直徑2.0MM的孔，4個(gè)直徑4.0MM的孔，4個(gè)直徑1.3MM的孔雙面沒有焊盤，但它們被定義成PTH孔，我們建議做NPTH孔The 2 holes with dia.2.0mm , 4 holes with dia.4.0mm and 4 holes with dia.1.3mm have no

27、pads on top and bottom copper layer .But they are specified PTH in drill chart. We suggest build them as NPTH.2這些孔（直徑1.4MM，1.6mm,1.8mm,2.5mm）被定義成PTH孔，但它們的焊盤與孔徑等大，我們建議做NPTH孔。These holes (1.4mm ,1.6mm,1.8mm,2.5mm)are specified PTH .But they have pads which are the same as the holes in copper layer .We

28、 suggest them NPTH.3.六個(gè)直徑0.25MM的孔在分孔圖中定義為NPTH孔，但它們的線路焊盤比孔大，我們建議做PTH孔。The 6 holes with dia.0.25mm are specified NPTH in drill chart .But they have pads which are larger than the holes in copper layers .We sugget them PTH .4. 直徑0.11“的孔對(duì)應(yīng)的焊盤比孔大，但它們被定義成NPTH孔，我們建議沿孔邊削銅皮0.3MM ，請(qǐng)確認(rèn)The hole with dia.0.11 ha

29、ve pad which is larger than the hole in top and bottom copper layer .But its specified NPTH.we suggest shaving the pads 0.3mm around the hole.Pls confirm.5.GERBER中孔的類型沒有定義，2個(gè)直徑0.120“的孔雙面沒有焊盤，我們想確認(rèn)這2個(gè)直徑0.120”的孔為NPTH孔。The hole type(PTH or NPTH) did not be define in the Gerber, the two holes of diamete

30、r 0.120 inch have not copper pads on both sides, we would like to confirm the two holes of diameter 0.120 inch are non-plating holes, please confirm .6.一些1.5mm的孔靠得非常近，建議把他們制成槽孔。Some holes with dia.1.5mm are very close each other, we suggest doing them oval hole.7.有兩個(gè)0.991、0.762重疊在一起，建議保留一個(gè)0.991mm的孔。

31、There are two holes with dia.0.991 mm and dia.0.762 mm overlap each other in one place,we suggest only dia.0.991mm remain there.8.在DRD孔表中直徑0.012英寸孔數(shù)是291，而在鉆孔文件中孔數(shù)是290，請(qǐng)確認(rèn)孔數(shù)是290而不是291。The quantity of diameter 0.012 inch in the hole chart of file DRD is 291, but(thruhole,tap) it is only 290. please co

32、nfirm the quantity of diameter 0.012 inch holes in the drill flie should be 290 not 291.9.在孔表中標(biāo)明1.7*1.9mm的槽數(shù)量為4個(gè)，但gerber中僅有兩個(gè)，建議按gerber制作。In the drilldraw file,it stated that the quantity of slots 1.7*1.9mm is 4 ,but we have found two slots in the gerber file ,we suggest as per gerber file.10.因?yàn)殂娡庑螞]

33、有定位孔，我們建議附邊加四個(gè)2.0mm孔。As no located holes for our routing,we suggest four additional holes with dia.2.0mmin waste tab.五、阻焊層1在字符J3處，一些0.065 inch & 0.0461 inch的孔兩面沒有開窗，為避免阻焊污染焊盤，在對(duì)孔雙面加開窗。On the location of J3,some holes of diameter 0.065 inch & 0.0461 inch have not mask opening on both sides, we would

34、like to add mask opening for these holes to avoid solder resist encroach the solder pad on both sides.2.這些焊盤僅TOP面有阻焊開窗，為了避免油墨滲上焊盤，我們建議在BOTTOM面也加上與TOP面等大的阻焊開窗These pads have single side mask opening on the top side , we suggest extra maskopening on the bottom side with same size as pads to avoid mask

35、 onto pad.3.我們發(fā)現(xiàn)6個(gè)直徑0.8MM的孔雙面沒有阻焊開窗，我們認(rèn)為它們應(yīng)為元件孔，建議雙面加直徑1.75MM的阻焊開窗。We found the 6 holes with dia.0.8mm have not solder-mask opening on both sides. We think they should be component holes. We suggest putting dia.1.75mm solder mask opening on their pads on both sides.4.我們發(fā)現(xiàn)單板內(nèi)有些光標(biāo)點(diǎn)沒開窗，這點(diǎn)我們應(yīng)該按原設(shè)計(jì)嗎？We f

36、ound some fiducials without mask opening in the unit.Should we following the original design?5.錫珠，小擋點(diǎn)根據(jù)原設(shè)計(jì)多數(shù)過孔沒有開窗，它們也沒有堵孔要求，在我們生產(chǎn)過程中，因?yàn)榭變?nèi)沒充滿綠油錫將會(huì)流進(jìn)這些孔內(nèi)，為此我們有三種建議：建議1：允許部分過孔孔內(nèi)有錫珠。建議2：若不同意建議1，我們將對(duì)這些孔雙面加一比孔大些的開窗，使用這種方法的結(jié)果是：這些過孔的孔壁不會(huì)有綠油，過孔焊盤被綠油覆蓋但有部分錫環(huán)。建議3：若不同意以上兩點(diǎn)，我們將對(duì)雙面未開窗的過孔進(jìn)行堵孔，但這將增加成本和增加制程時(shí)間，對(duì)我們來說

37、這種是最不利的選擇。我們希望你能選擇建議1或建議2。Most vias have no solder mask opening as per original design and no vias-plugged request .During our process, the solder will flow into the vias ,for they arent filled with solder resist completely.So our suggestion have three:suggestion1 :Solder ball in partial vias is per

38、mitted.Pls confirm.suggestion2: If you dont agree with our suggestion 1, we would like to put an opening with a size little larger than holes on both side .In this way,the wall of the vias will have no any solder resist ,one partial pads will be soldered and the other will be covered with solder res

39、ist.Pls confirm.suggestion3: If you dont agree with above two,we will have to plug those vias which have no opening on both side with solder resist . But it will increase our production cost and cause lead-time much. It is the worst way for us.We would like to hope you could choose our suggestion 1o

40、r 2.9. 過孔要求堵孔，但一些過孔頂層有開窗，建議保留過孔開窗且對(duì)0.46mm的過孔堵孔。The via is specified to be plugged. But some vias have mask opening in top layer. We suggest all vias with dia.0.406mm will be plugged and their mask opening in top layer will be kept. 12. 根據(jù)原設(shè)計(jì)光標(biāo)點(diǎn)開窗壓到周圍的些線或盤，建議削光標(biāo)點(diǎn)開窗，避免露線。In the borad ,some soldermask

41、opening of fiducial marks cover the nearby traces or pads on top side per original design. We suggest that shave a little soldermask opening of fiducial marks to avoid the trace exposed .14. 開窗與線路盤現(xiàn)狀不同，我們應(yīng)該修改開窗使按鍵處全部上金還是依據(jù)原設(shè)計(jì)制作？The solder mask opening shape mismatch the circuit pad , should we modif

42、y the solder mask opening shape to assure all the key pad will be covered with gold completely , or we will follow Gerber to do . 15. 能我們使用太陽PSR 2000油墨代替太陽PSR 4000油墨？因?yàn)槲覀儧]有這類型的油墨。Can we use the solder-mask type with TAYO ink PSR 2000 instead of TAYO ink PSR 4000 H85?because we have not this type 六、字

43、符層1.大部分的絲印字符都在焊盤上。我們建議此板沒有白字，如果需要絲印字符，我們建議刪去上焊盤的字符。Most of silkscreen is on the pads, we suggest no silkscreen, if we need to do silkscreen we suggest removal of those which are on pads.2.原設(shè)計(jì)白油上焊盤，為了避免油墨污染焊盤，我們建議削去上焊盤的白油，請(qǐng)確認(rèn)。There is white ink on the top pads per original design, We suggest shaving

44、the white ink in case of they contaminate pads. Pls confirm.3.一些字符靠近焊盤，恐怕它們會(huì)污染焊盤，建議允許削少許字符，也就是說字符殘缺是允許的。Some legends are close to pads .we are afraid they will contaminate the pads.so we suggest shaving them a bit.that is to say the defective legends is permittable.4.GERBER文件沒有發(fā)現(xiàn)絲印層，因此建議此板沒有字符，如果需要絲

45、印字符，請(qǐng)將字符文件發(fā)給我們。We didnt find any silkscreen layer in gerber file. So we suggest no silkscreen layers .If need ,Pls send us the file.5.在U1和U5區(qū)域，兩個(gè)IC焊盤的間距只有0.3MM ，如果按原設(shè)計(jì)制作，白油會(huì)污染焊盤，要不白油做少許更改，白油上焊盤是允許的。In U1 & U5 area the gap between two IC pads is only 0.3mm and the white ink will contaminate pads if w

46、e follow the original gerber, the other is to make minor change to white ink and IC pads contaminated is allowed.Pls confirm.6.按原設(shè)計(jì)，字符在大錫面上，是否為了避免白油污染錫面需要削掉白油，或者需要我們按原設(shè)計(jì)制作？請(qǐng)指示The notation just lie on the large solder pad per original design , if need us to shave ink to avoid ink contaminate the sold

47、er pad or need us to follow gerber to do? please advise.7. 所有底層字符都沒鏡像，建議沒有底層字符或如果要做出他們需要鏡像，請(qǐng)?zhí)岢瞿愕慕ㄗh。All the legends on bottom side are no mirror per gerber file,we suggest no bottom side silkscreen or they are mirror if we need to do them.Pls advise.8在GM4層有些字符，我們忽略它們或是加到頂層？There are some legends on t

48、he GM4,should we omit them or put them on top side silkscreen?9.由于單元比較小，沒有足夠的空間加我們的UL標(biāo)志及周期在每個(gè)單元內(nèi)，我們只能絲印我們的UL標(biāo)志及周期在附邊。As the unit is so small ,there is no large enough bare space to add our UL logo and date code in each unit we have to add our UL logo and date code on the waste tab by silkscreen.10.我

49、們發(fā)現(xiàn)其他制造商的標(biāo)志及周期在附邊上，我們建議用我們的UL標(biāo)志及周期替代加在附邊上（同樣板一樣），請(qǐng)確認(rèn)。We find the LOGO and the date code of other PCB manufacture is only in waste tab. We suggest using our LOGO instead.(is only in waste tab the same as the sample.).Pls confirm.11.頂層字符模糊不清，是否按3.bmp圖示修改？The legend is illegibility on the top layer sil

50、kscreen. Should we modify it as 3.bmp?12.板外有些字符和線路，建議刪去,請(qǐng)確認(rèn)。There are some circuit & notation out of the board,we suggest delete them.pls confirm.13. 字符層有些網(wǎng)格間距僅有0.076mm,對(duì)我們生產(chǎn)來說間距太小，建議按圖示修改。In top silkscreen layer, There is some grids.But the space is only 0.076mm .The space is too small to produce.

51、We suggest modifying these grids like 3.bmp shown.七、外形層1. *.DWG中沒體現(xiàn)拼板方向，建議拼板按照我們附件中的圖所示。We suggest panelization per our attached drawing for it does not show the unit-pcbs exact direction in the *.DWG.2. 單板外形與拼板外形不重合，建議按單板調(diào)整外形。The unit outline cannt match the panel profile.We suggest following the u

52、nit outline to modify. 3. 標(biāo)注尺寸與實(shí)測尺寸不同，建議以標(biāo)注尺寸為準(zhǔn)。The actual gerber dimension is different from the description in drill chart.we suggest per actual gerber.4.建議v-cut留厚按前版本0.3+/-0.1mm控制。We suggest the remain of the v-cut line as per old version.(0.3+/-0.1mm).5.要求的v-cut角度是30-45度，但我V-CUT 刀是30, 45,60度，它們的

53、公差是+/-5度，因此我們建議V-CUT角度30+/-5是允許的。The angle of V-CUT is specified 30-45 degree.But our normal reamer of V-CUT is only 30， 45,60 degree.Their tolerance is +/-5 degree .So we have to suggest the angle of V-CUT 30+/-5 degree is permitted.6.建議附邊與拼板相連以增加強(qiáng)度。We suggest waste tabs connected around the panel

54、to have it stronger.7. 在gerber 文件中我們沒有發(fā)現(xiàn)有外形層，請(qǐng)發(fā)外形文件給我們，否則我們無法制作。We did not find the outline of the board in gerber file ,please send outline gerber file to us,otherwise we can not manufature this board .8. 依據(jù)原設(shè)計(jì)槽寬僅有1.0mm，是否允許我們擴(kuò)大成2.0mm，以提高生產(chǎn)效率？The solts are only 1.0mm in original gerber,can we expand them to 2.0mm to improve our production efficiency?10. 此板尺寸較大，而郵票孔間距僅有0.15mm,建議增加間距到0.45以提高板的強(qiáng)度。The gap between snap off holes is only 0.15mm,and the size of board is large. We suggest decreasing the snap off holse (dia.0.599mm) to 0.45mm to get the web stronger.六、疊層1.在文件中未指定疊層順序，我們確認(rèn)疊層順序?yàn)椋簍op-