SMD專業(yè)術(shù)語(yǔ)中英文對(duì)照電子類知識(shí)寶典

SMD常用術(shù)語(yǔ)微組裝技術(shù):MPT/MicroelectronicPackagingechnology混裝技術(shù):MixedComponentMountingTechnology封裝：Package貝占片：PickandPlace拆焊：Desoldering再流：Reflow浸焊：DipSoldering拖焊:Dragsoldering印制電路：PrintedCircuit印制線路：PrintedWiringER制電路板：printedcircuitboardER制線路板：printedwiringboard層壓板:laminate覆銅薄層壓板：copper-cladlaminate基材:basematerial成品板:productionboardER刷：printing導(dǎo)電圖形:conductivepatternprintedcomponent單面印制板:single-sidedprintedboard雙面印制板：double-sidedprintedboard多層印制板：multilayerprintedboard電烙鐵：Iron熱風(fēng)嘴:hotairreflowingnoozle吸錫帶：solderingwick吸錫器：tinextractor焊后檢驗(yàn):post-solderinginspection目視檢驗(yàn)：visualinspection機(jī)器檢驗(yàn)：machineinspection焊點(diǎn)質(zhì)量:solderingjointquality焊電缺陷：solderingjontdefect錯(cuò)焊:solderwrong漏焊:solderskips虛焊：pseudosoldering冷焊：coldsoldering橋焊：solderbridge脫焊:opensoldering焊點(diǎn)剝離：solderoff不潤(rùn)濕焊點(diǎn):solderingnonwetting錫珠：solderball拉尖：icicle;solderprojection孔洞：void焊料爬越：solderwicking過(guò)熱焊點(diǎn):overheatedsolderconnection不飽和焊點(diǎn):insufficientsolderconnection過(guò)量焊點(diǎn):excesssolderconnection微組裝技術(shù):MPT/MicroelectronicPackagingechnology混裝技術(shù):MixedComponentMountingTechnology封裝：Package貝占片：PickandPlace拆焊：Desoldering再流：Reflow浸焊：DipSoldering拖焊:Dragsoldering印制電路：PrintedCircuit印制線路：PrintedWiringER制電路板：printedcircuitboardER制線路板：printedwiringboard層壓板:laminate覆銅薄層壓板：copper-cladlaminate基材：basematerial成品板：productionboardER刷：printing導(dǎo)電圖形:conductivepatternER制組件:printedcomponent單面印制板：single-sidedprintedboard雙面印制板：double-sidedprintedboard多層印制板：multilayerprintedboard電烙鐵：Iron熱風(fēng)嘴:hotairreflowingnoozle吸錫帶：solderingwick吸錫器：tinextractor焊后檢驗(yàn):post-solderinginspection目視檢驗(yàn)：visualinspection機(jī)器檢驗(yàn)：machineinspection焊點(diǎn)質(zhì)量:solderingjointquality焊電缺陷：solderingjontdefect錯(cuò)焊:solderwrong漏焊:solderskips虛焊：pseudosoldering冷焊：coldsoldering橋焊：solderbridge脫焊:opensoldering焊點(diǎn)剝離：solderoff不潤(rùn)濕焊點(diǎn):solderingnonwetting錫珠：solderball拉尖：icicle;solderprojection孔洞：void焊料爬越：solderwicking過(guò)熱焊點(diǎn):overheatedsolderconnection不飽和焊點(diǎn):insufficientsolderconnection過(guò)量焊點(diǎn):excesssolderconnection助焊劑剩余：fluxresidue焊料裂紋：soldercrazeing焊角翹起：fillet-lifting；lift-offAI:Auto-Insertion自動(dòng)插件AQL:acceptablequalitylevel允收水平ATE:automatictestequipment自動(dòng)測(cè)試ATM:atmosphere氣壓BGA:ballgridarray球形矩陣CCD:chargecoupleddevice監(jiān)視連接組件（攝影機(jī)）CLCC:Ceramicleadlesschipcarrier陶瓷引腳載具COB:chip-on-board芯片直接貼附在電路板上cps:centipoises（黏度單位）百分之——CSB:chipscaleballgridarray芯片尺寸BGACSP:chipscalepackage芯片尺寸構(gòu)裝CTE:coefficientofthermalexpansion熱膨脹系數(shù)DIP:dualin-linepackage雙內(nèi)線包裝（泛指手插組件）FPT:finepitchtechnology微間距技術(shù)FR-4:flame-retardantsubstrate玻璃纖維膠片（用來(lái)制作PCB材質(zhì)）IC:integratecircuit集成電路IR:infra-red紅外線Kpa:kilopascals（壓力單位）LCC:leadlesschipcarrier弓I腳式芯片承載器MCM:multi-chipmodule多層芯片模塊MELF:metalelectrodeface二極管MQFP:metalizedQFP金屬四方扁平封裝NEPCON:NationalElectronicPackageandProductionConference國(guó)際電子包裝及生產(chǎn)會(huì)議ppm:partspermillion指每百萬(wàn)PAD（點(diǎn)）有多少個(gè)不良PAD（點(diǎn)）psi:pounds/inch2磅/英寸2PWB:printedwiringboard電路板QFP:quadflatpackage四邊平坦封裝SIP:singlein-linepackageSIR:surfaceinsulationresistance絕緣阻抗SMC:SurfaceMountComponent表面黏著組件SMD:SurfaceMountDevice表面黏著組件SMEMA:SurfaceMountEquipmentManufacturersAssociation表面黏著設(shè)備制造協(xié)會(huì)SMT:surfacemounttechnology表面黏著技術(shù)SOIC:smalloutlineintegratedcircuitSOJ:smallout-linej-leadedpackageSOP:smallout-linepackage小夕卜型封裝SOT:smalloutlinetransistor晶體管SPC:statisticalprocesscontrol統(tǒng)計(jì)過(guò)程控制SSOP:shrinksmalloutlinepackage收縮型小外形封裝TAB:tapeautomaticedbonding帶狀自動(dòng)結(jié)合TCE:thermalcoefficientofexpansion膨脹（因熱）系數(shù)Tg:glasstransitiontemperature玻璃轉(zhuǎn)換溫度THD:Throughholedevice須穿過(guò)洞之組件（貫穿孔）TQFP:tapequadflatpackage帶狀四方平坦封裝UV:ultraviolet紫外線uBGA:microBGA微小球型矩陣cBGA:ceramicBGA陶瓷球型矩陣PTHlatedThruHole導(dǎo)通孔lAInformationAppliance信息家電產(chǎn)品MESH網(wǎng)目OXIDE氧化物FLUX助焊劑LGA（LandGridArry）封裝技術(shù)LGA封裝不需植球，適合輕薄短小產(chǎn)品應(yīng)用。TCP（TapeCarrierPackage）ACFAnisotropicConductiveFilm異方性導(dǎo)電膠膜制程Soldermask防焊漆SolderingIron烙鐵Solderballs錫球SolderSplash錫渣SolderSkips漏焊Throughhole貫穿孔Touchup補(bǔ)焊Briding襦接（短路）SolderWires焊錫線SolderBars錫棒GreenStrength未固化強(qiáng)度（紅膠）TransterPressure轉(zhuǎn)印壓力（印刷）ScreenPrinting刮刀式印刷SolderPowder錫顆粒Wettengability潤(rùn)濕能力Viscosity黏度Solderability焊錫性Applicability使用性Flipchip覆晶DepanelingMachine組裝電路板切割機(jī)SolderRecoverySystem錫料回收再使用系統(tǒng)WireWelder主機(jī)板補(bǔ)線機(jī)X-RayMulti-layerInspectionSystemX-Ray孔偏檢查機(jī)BGAOpen/ShortX-RayInspectionMachineBGAX-Ray檢測(cè)機(jī)PrepregCopperFoilSheeterP.P.銅箔裁切機(jī)FlexCircuitConnections軟性排線焊接機(jī)LCDReworkStation液晶顯示器修護(hù)機(jī)BatteryElectroWelder電池電極焊接機(jī)PCMCIACardWelderPCMCIA卡連接器焊接LaserDiode半導(dǎo)體雷射IonLasers離子雷射Nd:YAGLaser石榴石雷