IPC標(biāo)準(zhǔn)修訂版本列表2016統(tǒng)計(jì)

ProductIDDocumentNameResponsibleCommitteeStatusDoDJ-STD-001RequirementsforSolderedElectricalandElectronicAssemblies5-22aRevFAm112/15RevF08/14RevE4/10RevDAmend14/08RevD2/05RevC3/00RevB10/96RevA1/95Orig.4/92;SupersedesIPC-S-81507/01J-STD-001xSSpaceHardwareAddendumSpaceApplicationsElectronicHardwareAddendumforJ-STD-001.TheaddendumMUSTbeusedwiththesameversionofthestandard;e.g.001CSwith001C,001DSwith001D,001ESwith001D5-22asFS2/15ES12/10DSAmend19/09DS11/06CS1/04IPC-HDBK-001HandbookandGuidetotheRequirementsforSolderedElectricalandElectronicAssemblies5-22fRevF2/16RevE2/12Amend210/05Amend112/00Orig.3/9807/01SMC-TR-001AnIntroductiontoTapeAutomatedBondingFinePitchTechnologyOrig.1/89IT-WP-001MythsofE-CommerceOrig.9/00SMC-WP-001SolderingCapabilityWhitePaperReportOrig.8/91SMEMA1.2MechanicalEquipmentUpdate

InterfaceStandardIPC-SMEMA-9851JP002CurrentTinWhiskersTheoryandMitigationPracticesGuideline5-23eOrig.3/06J-STD-002SolderabilityTestsforComponentLeads,Terminations,Lugs,TerminalsandWires5-23bRevD6/13RevCAmend110/08RevC12/07RevB2/03RevA10/98Orig.4/92;SupersedesIPC-S-80505/95SMC-WP-002AnAssessmentoftheUseofLeadinElectronicAssemblyObsoletewithoutreplacementOrig.8/92J-STD-003SolderabilityTestsforPrintedBoards5-23aRevCAmend19/14RevC9/13RevB2/07RevA2/03Original4/92;SupersedesIPC-S-80401/04SMC-WP-003ChipMountingTechnologyOrig.8/93SMEMA3.1FiducialMarkStandardJ-STD-004RequirementsforSolderingFluxes5-24aRevB.Amend1—11/11RevB12/08RevA1/04Orig.1/95;SupersedesIPC-SF-81805/95SMC-WP-004DesignforSuccessOrig.4/97SMEMA4ReflowTermsandDefinitionsJ-STD-005RequirementsforSolderingPastes5-24bRevA2/12Amend16/9605/95

Orig.1/95;SupersedesIPC-SP-819SMC-WP-005PWBSurfaceFinishesOrig.4/97IPC-HDBK-005GuidetoSolderPasteAssessment5-24bOrig.1/06SMEMA5ScreenPrintingTermsandDefinitionsJ-STD-006RequirementsforElectronicGradeSolderAlloysandFluxedandNon-FluxedSolidSoldersforElectronicSolderingApplications5-24cRevC7/13RevBAmends1&210/09RevBAmend16/08RevB1/06RevA5/01Amend17/96Orig.1/9505/95SMEMA6ElectronicsCleaningTermsandDefinitionsSMEMA7FluidDispensingTermsandDefinitionsIPC-WP-008SettingupIonChromatographyCapabilityOrig.12/05J-STD-012ImplementationofFlipChipandChipScaleTechnology5-21gSupersededbyIPC-709410/13Orig.1/96J-STD-013ImplementationofBallGridArrayandOtherHighDensityTechnology5-21fSupersededbyIPC-709510/13Orig.7/96IPC-DRM-18ComponentIdentificationDeskReferenceManualRevH11/07RevG9/03RevF8/01RevE8/00RevD7/99RevC7/98RevB2/97RevA4/96Orig.9/95

J-STD-020Moisture/ReflowSensitivityClassificationofPlasticSurfaceMountDevicesB-10aRevE12/14RevDAmend13/08RevD8/07RevC7/04RevB7/02RevA4/99Orig.10/96J-STD-026SemiconductorDesignStandardforFlipChipApplications5-21gOrig.8/99J-STD-027MechanicalOutlineStandardforFlipChiporChipScaleConfigurations5-21gOrig.2/03J-STD-028PerformanceStandardforFlipChipScaleBumps5-21gOrig.8/99J-STD-030SelectionandApplicationofBoardLevelUnderfillMaterials5-24fRevA3/14Orig.9/05J-STD-032PerformanceStandardforBallGridArrayBumpsandColumns5-21fOrig.6/02J-STD-033PackagingandHandlingofMoistureSensitiveNon-HermeticSolidStateSurfaceMountDevicesB-10aRevC2/12RevBAmend11/07RevB10/05RevA7/02Orig.4/99J-STD-035AcousticMicroscopyforNon-HermeticEncapsulatedElectronicComponentsB-10aOrig.4/99IPC-0040OptoelectronicAssemblyandPackagingTechnology5-25Orig.5/03J-STD-048NotificationStandardforProductDiscontinuance2-15fOrig.5/15IPC-T-50TermsandDefinitionsforInterconnectingand2-30RevM6/15RevK7/1309/80

PackagingElectronicCircuitsRevJ10/11RevISkippedDuetoConflictwith“L”andRevH7/08RevG12/03RevF6/96RevE7/92RevD11/88RevC3/85RevB6/80RevA8/76Orig.8/75“1”IPC-DRM-53IntroductiontoElectronicsAssemblyOrig.6/00IPC-SC-60PostSolderSolventCleaningHandbook5-31aSupersededandcombinedintoCH-65B5/11RevA8/99Orig.4/87IPC-SA-61Post-SolderSemi-AqueousCleaningHandbook5-31bSupersededandcombinedintoCH-65B5/11RevA6/02Orig.7/95IPC-AC-62PostSolderAqueousCleaningHandbook5-31bSupersededandcombinedintoCH-65B5/11RevA1/96Orig.12/86IPC-CH-65GuidelinesforCleaningofPrintedBoardsandAssemblies5-31dRevB7/11RevA9/99Orig.12/90IPC-CS-70GuidelinesforChemicalHandlingSafetyinPrintedBoardManufacturingObsoletewithoutreplacementOrig.8/88J-STD-075ClassificationofNon-ICElectronicComponentsB-10aOrig.8/08

forAssemblyProcessesIPC-CM-78GuidelinesforSurfaceMountingandInterconnectingChipCarriersSupersededbyIPC-SM-780RevC-3/88Orig.11/83IPC-MP-83IPCPolicyonMetricationObsoletewithoutreplacementOrig.8/85IPC-PC-90GeneralRequirementsforImplementationofStatisticalProcessControl7-22SupersededbyIPC-9191Orig.10/90W02/03IPC-QS-95GeneralRequirementsforImplementationofISO9000QualitySystems7-22ObsoletewithoutreplacementOrig.4/93IPC-L-108SpecificationforThinMetalCladBaseMaterialsforMultilayerPrintedBoards3-11SupersededbyIPC-4101RevB6/90RevA10/80Orig.3/76IPC-L-109SpecificationforResinImpregnatedFabric(Pregreg)forMultilayerPrintedBoards3-11SupersededbyIPC-4101RevB7/92RevA10/80Orig.3/76IPC-L-110Preimpregnated,B-StageEpoxy-GlassClothforMultilayerPrintedCircuitBoards3-11RevASupersededbyIPC-L-109andIPC-4101IPC-CC-110GuidelinesforSelectingCoreConstructionsforMultilayerPrintedWiringBoardApplications3-11cSupersededbyIPC-4121RevA12/97Orig.1/94IPC-L-112SpecificationforCompositeMetalCladBaseMaterialsforPrintedBoards3-11SupersededbyIPC-4101RevA6/92Orig.7/81IPC-L-115SpecificationforRigidMetalCladBase3-11SupersededbyIPC-4101

MaterialsforPrintedBoardsRevB4/90RevA10/80Orig.3/77IPC-L-120InspectionProcedureforChemicalProcessingSuitabilityofCopper-CladEpoxy-GlassLaminatesObsoletewithoutreplacementIPC-L-125SpecificationsforPlasticSubstratesCladorUncladforHighSpeed/HighFrequencyInterconnectionsD-23SupersededbyIPC-4103RevA7/92Orig.8/83IPC-L-130SpecificationsforThinLaminates,MetalClad,PrimarilyforGeneral-PurposeMultilayerPrintedBoards3-11SupersededbyIPC-L-108andIPC-4101Orig.1/77IPC-DD-135QualificationTestingforDepositedOrganicInterlayerDielectricMaterialsforMultichipModulesObsoletewithoutreplacementOrig.8/95IPC-EG-140SpecificationforFinishedFabricWovenfrom"E”GlassforPrintedBoards3-12dSupersededbyIPC-4412Amend1&26/97Orig.3/88W02/03IPC-SG-141SpecificationforFinishedFabricWovenfrom"S”GlassforPrintedBoards3-12dOrig.2/927/93IPC-A-142SpecificationforFinishedFabricWovenfromAramidforPrintedBoards3-12Orig.6/90W05/12IPC-QF-143GeneralSpecificationforFinishedFabricWovenfromQuartz(PureFusedSilica)forPrinted3-12dOrig.2/92W6/11

BoardsIPC-CF-148ResinCoatedMetalforPrintedBoards3-12cSupersededbyIPC-4563RevA9/98Orig.6/90IPC-MF-150MetalFoilforPrintedWiringApplications3-12aSupersededbyIPC-45625/00Amend18/92RevF10/91ChangedfromCF-150toMF-150RevE5/81RevD3/76RevC8/74RevB2/71RevA9/67Orig.8/66W02/02IPC-CF-152CompositeMetallicMaterialSpecificationforPrintedWiringBoards3-12hRevB12/97RevA1/94Orig.6/90IPC-FC-203SpecificationforFlatCable,RoundConductor,GroundPlaneD-13Obsolete7/96Orig.7/85IPC-FC-210PerformanceSpecificationforFlat-ConductorUndercarpetPowerCable(TypeFCC)D-13Obsolete7/96Orig.9/85IPC-FC-213PerformanceSpecificationforFlatUndercarpetTelephoneCableD-13*Obsolete7/96Orig.9/84IPC-FC-217GeneralDocumentforConnectors,Electric,Header,Receptacle,InsulationDisplacementforUsewithRoundConductorFlatCableD-13Obsolete7/96Reaffirmed4/90Orig.8/82

IPC-FC-218B/EIA-RS-429GeneralSpecificationforConnectors,ElectricalFlatCableTypeD-13Obsolete7/96Reaffirmed5/91Reaffirmed11/81Orig.7/76IPC-FC-219EnvironmentSealedFlatCableConnectorsforuseinAerospaceApplicationsD-13Obsolete7/96Orig.5/84IPC-FC-220SpecificationforFlatCable,FlatConductor,UnshieldedD-13Obsolete7/96RevC7/85RevB8/75RevA1/74Orig.5/70IPC-FC-221SpecificationforFlat-CopperConductorsforFlatCablesD-13Obsolete7/96RevA5/84Orig.8/75IPC-FC-222SpecificationofFlatCableRoundConductor,UnshieldedD-13Obsolete7/96Reaffirmed5/91Orig.6/80IPC-FC-225FlatCableDesignGuideD-13Obsolete7/96Reaffirmed10/85Orig.8/75IPC-FC-231FlexibleBaseDielectricsforUseinFlexiblePrintedWiringD-13SupersededbyIPC-4202Amend10/95RevC4/92RevB2/86RevA5/83Orig.7/74W03/03IPC-FC-232AdhesiveCoatedDielectricFilmsforUseasCoverSheetsforFlexiblePrintedWiringandFlexibleBondingFilmsD-13Supersededby42035/02Amend10/95RevC6/94RevB2/86RevA5/83Orig.7/74W03/03IPC-FC-233FlexibleAdhesiveBondingFilmsD-13IncorporatedintoW11/03

IPC-FC-232C6/94RevA2/86Orig.5/83IPC-FC-234PSAAssemblyGuidelinesforSingle-&Double-SidedFlexiblePrintedCircuitsD-1RevA12/14Orig.12/97IPC-FC-240SinglesidedflexD-12SupersededbyIPC-6013IncorporatedintoFC-250RevB1/74RevA5/69Orig.12/65IPC-FC-241FlexibleMetal-CladDielectricsforUseinFabricationofFlexiblePrintedWiringD-13*SupersededbyIPC-4204Amend10/95RevC4/92RevB2/86RevA5/83Orig.7/74W02/02IPC-RF-245PerformanceSpecificationforRigid-FlexPrintedBoardsD-12SupersededbyIPC-6013Orig.4/87IPC-D-249DesignStandardforFlexibleSingle-andDouble-SidedPrintedBoardsD-11SupersededbyIPC-2223Orig.1/87IPC-FC-250SpecificationforSingle-andDouble-SidedFlexiblePrintedWiringD-12SupersededbyIPC-6013RevA9/86Orig.1/74IPC-FA-251GuidelinesforSingleandDoubleSidedFlexCircuitsD-12Orig.2/92IPC-D-275DesignStandardforRigidPrintedBoardsandRigidPrintedBoardAssembliesD-31bSupersededbyIPC-2221and2222SupersedesW10/09

IPC-D-319andIPC-D-949Amendment14/96Orig.9/91IPC-RB-276QualificationandPerformanceSpecificationforRigidPrintedBoardsD-33aSupersededbyIPC-6011andIPC-6012Orig.3/92;SupersedesIPC-SC-320BandIPC-ML-950CIPC-D-279DesignGuidelinesforReliableSurfaceMountTechnologyPrintedBoardAssemblies6-10bOrig.7/96IPC-D-300PrintedBoardDimensionsandTolerances1-10aSupersededbyIPC-2615RevG1/84RevF11/74RevE10/70RevD1/70RevC10/65RevB1/64RevA7/61Orig.8/60IPC-D-310GuidelinesforPhototoolGenerationandMeasurementTechniquesRevC6/91RevB12/85RevA12/77Orig.9/69IPC-A-311ProcessControlGuidelinesforPhototoolGenerationandUseOrig.3/96IPC-D-316DesignGuideforMicrowaveCircuitBoardsUtilizingSoftSubstratesD-21bSupersededbyIPC-2252Orig.5/95IPC-D-317DesignGuidelinesforElectronicPackagingUtilizingHigh-SpeedTechniquesD-21aSupersededbyIPC-2251RevA1/95Orig.4/90

IPC-HF-318MicrowaveEndProductBoardInspectionandTestD-22SupersededbyIPC-6018RevA12/91Orig.6/85IPC-D-319DesignStandardforRigidSingle-andDouble-SidedPrintedBoardsD-31bSupersededbyIPC-D-275,thenbyIPC-2221/2222Orig.1/87IPC-SD-320PerformanceSpecificationforRigidSingle-andDouble-SidedPrintedBoardsD-33aSupersededbyIPC-RB-276SupersedesIPC-TC-500RevB11/86RevA3/81Orig.1/77IPC-D-322GuidelinesforSelectingPrintedWiringBoardSizesUsingStandardPanelSizesReaffirmed9/91Orig.8/8410/94IPC-MC-324PerformanceSpecificationsforMetalCoreBoardsD-33aSupersededbyIPC-6011andIPC-6012Orig.10/88IPC-D-325DocumentationRequirementsforPrintedBoards,AssembliesandSupportDrawings2-40RevA5/95Orig.1/87IPC-D-326InformationRequirementsforManufacturingPrintedBoardAssemblies2-11aRevA1/04Orig.4/91IPC-D-330DesignGuideManualSupersededbyIPC-2221,IPC-2222andIPC-7351Orig.1/92IPC-PD-335ElectronicPackagingHandbookOrig.12/89IPC-NC-349ComputerNumericalOrig.8/8510/85

ControlFormattingforDrillersandRoutersIPC-D-350PrintedBoardDescriptioninDigitalForm;TechnicalContentIdenticaltoIEC-61182-12-11RevD7/92RevC10/85RevB8/77RevA2/75Orig.8/7207/78IPC-D-351PrintedBoardDrawingsinDigitalFormOrig.8/8509/85IPC-D-352ElectronicDesignDataDescriptionforPrintedBoardsinDigitalFormOrig.8/8509/85IPC-D-354LibraryFormatDescriptionforPrintedBoardsinDigitalFormOrig.2/87IPC-D-355PrintedBoardAssemblyDescriptioninDigitalFormOrig.1/95IPC-D-356BareBoardElectricalTestInformationinDigitalForm2-11cRevB10/02RevA1/98Orig.3/9208/92IPC-AM-361SpecificationforRigidSubstratesforAdditiveProcessPrintedBoardsSupersededbyIPC-4101Orig.1/82IPC-MB-380GuidelinesforMoldedInterconnectionDevicesOrig.10/90IPC-D-390AutomatedDesignGuidelinesRevA2/88Orig.7/74IPC-C-406DesignandApplicationGuidelinesforSurfaceMountConnectorsOrig.1/90IPC-CI-408SolderlessSurfaceMountConnectorDesignCharacteristicsandApplicationGuidelinesB-22cOrig.1/94IPC-BP-421GeneralSpecificationforRigidPrintedBoardBackplaneswithPressFitContactsObsoletewithoutreplacementReaffirmed4/90Orig.10/80

IPC-D-422DesignGuideforPressFitRigidPrintedBoardBackplanesOrig.9/82IPC-DW-424GeneralSpecificationforEncapsulatedDiscreteWireInterconnectionBoardsOrig.1/95IPC-DW-425DesignandEndProductRequirementsforDiscreteWiringBoardsRevA5/90Orig.9/8203/94IPC-DW-426SpecificationsforAssemblyofDiscreteWiringOrig.12/87IPC-TR-460Trouble-ShootingChecklistforWaveSolderingPrintedWiringBoardsRevA2/84Orig.1973IPC-TR-461SolderabilityEvaluationofThickandThinFusedCoatingsOrig.3/79IPC-TR-462SolderabilityEvaluationofPrintedBoardswithProtectiveCoatingsOverLongTermStorageOrig.10/87IPC-TR-464AcceleratedAgingforSolderabilityEvaluations5-23bAddendum12/87Orig.4/84IPC-TR-465-1RoundRobinTestonSteamAgerTemperatureControlStabilityOrig.1993IPC-TR-465-2TheEffectofSteamAgingTimeandTemperatureonSolderabilityTestResultsOrig.1993IPC-TR-465-3EvaluationofSteamAgingonAlternativeFinishes,PhaseIIAOrig.7/96

IPC-TR-466WettingBalanceStandardWeightComparisonTestOrig.4/95IPC-TR-467SupportingDataandNumericalExamplesforANSI/J-STD-001AppendixDOrig.10/96IPC-TR-468FactorsAffectingInsulationResistancePerformanceofPrintedBoardsOrig.3/79IPC-TR-470ThermalCharacteristicsofMultilayerInterconnectionBoardsOrig.1/74IPC-TR-474AnOverviewofDiscreteWiringTechniquesObsoletewithoutreplacementReprint1984Orig.3/79IPC-TR-476HowtoAvoidMetallicGrowthProblemsonElectronicHardwareRevAElectrochemicalMigrationElectricallyInducedFailuresInPrintedAssembliesRevA6/84(newtitle)Orig.9/77IPC-TR-480ResultsofMultilayerTestProgramRoundRobinIVPhaseIObsoletewithoutreplacementOrig.9/75IPC-TR-481ResultsofMultilayerTestProgramRoundRobinVOrig.4/81IPC-TR-482NewDevelopmentsinThinCopperFoilsOrig.1/76IPC-TR-483DimensionalStabilityTestingofThinLaminates-ReportonPhaseIInternationalRoundRobinTestProgramRevA3/91Addendums10/87Orig.4/84

IPC-TR-484ResultsofIPCCooperFoilDuctilityRoundRobinStudyOrig.4/86IPC-TR-485ResultsofCooperFoilRuptureStrengthTestRoundRobinStudyOrig.3/85IPC-TR-486ReportonRoundRobinStudytoCorrelateInterconnectStressTest(IST)withThermalStress/MicrosectioningEvaluationsforDetectingthePresenceofInner-layerSeparationsOrig.7/01IPC-TR-549MeaslesinPrintedWiringBoardsOrig.11/78IPC-TR-551QualityAssessmentofPrintedBoardsUsedforMountingandInterconnectingElectronicComponentsOrig.7/93IPC-DR-570GeneralSpecificationfor1/8InchDiameterShankCarbideDrillsforPrintedBoards4-12RevA4/84Orig.1/79IPC-DR-572DrillingGuidelinesforPrintedBoards4-12RevA3/07Orig.4/88IPC-TR-575AdditiveProcessEvaluation-ReportonPhaseIIPCRoundRobinTestingProgramonAdditivePrintedWiringBoardsObsoletewithoutreplacementOrig.4/75IPC-TR-576AdditiveProcessEvaluationObsoletewithoutreplacementOrig.9/77IPC-TR-577AdditiveProcessEvaluation-ReportonPhaseIIIIPCRoundObsoletewithoutreplacement

RobinTestingProgramonRigidAdditivePrintedBoardsOrig.4/80IPC-TR-578LeadingEdgeManufacturingTechnologyReport-ResultingofaRoundRobinStudyonMinimumConductorWidthandPlated-ThroughHolesinRigid,BareCopper,Double-SidedPrintedWiringBoardsOrig.9/84IPC-TR-579RoundRobinReliabilityEvaluationofSmallDiameterPlatedThroughHolesinPrintedWiringBoardsOrig.9/88IPC-TR-580CleaningandCleanlinessTestProgramPhase1TestResultsOrig.10/89IPC-TR-581IPCPhase3ControlledAtmosphereSolderingStudyOrig.8/94IPC-TR-582IPCPhase3No-CleanFluxStudyOrig.11/94IPC-TR-583AnIn-DepthLookAtIonicCleanlinessTestingOrig.7/02IPC-WP/TR-584IPCWhitePaperandTechnicalReportonHalogen-FreeMaterialsusedforPrintedCircuitBoardsandAssemblies4-33RevA8/07Orig.4/03IPC-TR-585Time,TemperatureandHumidityStressofFinalBoardFinishSolderabilityOrig.5/06IPC-TR-586ImmersionSilverPlating4-14Orig.5/09

ThicknessRoundRobinInvestigationDataSetCompendium(supportsIPC-4553A)IPC-A-600AcceptabilityofPrintedBoards7-31a&D-33aRevH4/10RevGAmend11/08RevG7/04RevF11/99RevE8/95RevD'89RevC'78RevB'74RevA'70Orig.'64IPC-SS-605PrintedBoardQualityEvaluationSlideSetObsoletewithoutreplacementIPC-QE-605PrintedBoardQualityEvaluationHandbook7-31cRevA2/99J-STD-609MarkingandLabelingofComponents,PCBsandPCBAstoIdentifyLead(Pb)Pb-FreeandOtherAttributesandDevices4-34bRevA3/10Orig.5/07;supersedesIPC-106601/08IPC-A-610AcceptabilityofElectronicAssemblies7-31bRevFAmend112/15RevF8/14RevE4/10RevDAmend14/08RevD2/05RevCAmend111/01RevC1/00RevB12/94RevA3/90Orig.8/8302/02IPC-A-610DCIPC-A-610DTelecomAddendum7-31bcOrig.8/09IPC-HDBK-610HandbookandGuidetoIPC-A-610(IncludesAmend110/05

B-C-Dcomparison)Orig.9/02IPC-QE-615AssemblyQualityEvaluationHandbookObsoletewithoutreplacementIPC-D-620DesignandCriticalProcessRequirementsforCableandWiringHarnesses7-31kOrig.2/16IPC/WHMA-A-620AcceptabilityofElectronicWireHarnessesandCables7-31fRevB.Amend18/13RevB10/12RevA7/06Orig.1/02IPC/WHMA-A-620SpaceHardwareAddendumSpaceApplicationsElectronicHardwareAddendumforIPC/WHMA-A-620.TheaddendumMUSTbeusedwiththesameversionofthestandard;e.g.620ASwith620A7-31fs620B-Space6/13620AAmend17/12620A-Space1/11IPC-A-630AcceptabilityStandardforManufacture,InspectionandTestingofElectronicEnclosures7-31jOrig.9/13IPC-HDBK-630GuidelinesforDesign,Manufacture,Inspection,andTestingofElectronicEnclosures7-31jOrig.7/14IPC-AI-640User'sGuidelinesforAutomatedInspectionofUnpopulatedThickFilmHybridSubstratesObsoletewithoutreplacementOrig.1/87IPC-AI-641User'sGuidelinesforAutomatedSolderJointInspectionObsoletewithoutreplacementOrig.1/87IPC-AI-642User'sGuidelinesforAutomatedInspectionofArtwork,Interlayers,andUnpopulatedPWB'sObsoletewithoutreplacementOrig.10/88

IPC-OI-645StandardforVisualOpticalInspectionAids7-31dOrig.10/93IPC-TM-650TestMethodsManualUpdatedpertestmethodIPC-ET-652GuidelinesandRequirementsforElectricalTestingofUnpopulatedPrintedBoardsSupersededbyIPC-9252Orig.10/90IPC-QL-653QualificationofFacilitiesthatInspect/TestPrintedBoards,Components,andMaterial7-10cRevA11/97Orig.8/8807/89IPC-MI-660IncomingInspectionofRawMaterialsManualOrig.2/84IPC-R-700SuggestedGuidelinesforModification,ReworkandRepairofPrintedBoardsandAssembliesSupersededbyIPC-7711A/7721ARevC1/88RevB9/77RevA12/71Orig.9/67IPC-TA-720TechnologyAssessmentHandbookonLaminatesOrig.’86IPC-TA-721TechnologyAssessmentHandbookonMultilayerBoardsOrig.’88IPC-TA-722TechnologyAssessmentofSolderingOrig.’90IPC-TA-723TechnologyAssessmentHandbookonSurfaceMountingOrig,’91IPC-TA-724TechnologyAssessmentSeriesonCleanroomsOrig.4/98IPC-PE-740TroubleshootingGuideforPrintedBoardManufactureandAssembly7-23RevA12/97Orig.1/85IPC-CM-770GuidelinesforPrinted5-21aRevE1/04

BoardComponentMountingRevD1/96RevC1/87RevB10/80RevA3/76Orig.9/68IPC-SM-780ComponentPackagingandInterconnectingwithEmphasisonSurfaceMountingOrig.3/88IPC-SM-782SurfaceMountDesignandLandPatternStandard1-13SupersededbyIPC-7351RevAAmend24/99RevAAmend110/96RevA8/93Orig.3/87IPC-SM-784GuidelinesforChip-on-BoardTechnologyImplementationOrig.11/90IPC-SM-785GuidelinesforAcceleratedReliabilityTestofSurfaceMountSolderAttachmentsOrig.11/92IPC-SM-786ProceduresforCharacterizingandHandlingofMoisture/ReflowSensitiveICsSupersededbyJ-STD-020andJ-STD-033RevA1/95Orig.12/90IPC-MC-790GuidelinesforMultichipModuleTechnologyUtilizationOrig.8/92IPC-S-8015-23aSupersededbyIPC-804andJ-STD-003IPC-S-8035-23aSupersededbyIPC-804andJ-STD-003IPC-S-804SolderabilityTestMethodsforPrinted5-23aSupersededbyJ-STD-003

WiringBoardsRevA1/87Orig.1/82IPC-S-805SolderabilityTestsforComponentLeadsandTerminations5-23bSupersededbyJ-STD-002Orig.1/85IPC-MS-810GuidelinesforHighVolumeMicrosectionOrig.10/93IPC-S-815GeneralRequirementsforSolderingElectronicInterconnectionsSupersededbyJ-STD-001RevB12/87RevA6/81Orig.11/77IPC-S-816SMTProcessGuidelineandChecklistOrig.7/93IPC-SM-817GeneralRequirementsforDielectricSurfaceMountingAdhesives5-21kRevA12/14Orig.11/89IPC-SF-818GeneralRequirementforElectronicSolderingFluxes5-24aSupersededbyJ-STD-004Rev12/91Orig.2/88IPC-SP-819GeneralRequirementsandTestMethodsforElectronicGradeSolderPaste5-24bSupersededbyJ-STD-005Orig.10/88IPC-AJ-820AssemblyandJoiningManualJul-35RevA2/12Orig.4/97IPC-CA-821GeneralRequirementsforThermallyConductiveAdhesivesOrig.1/95IPC-CC-830QualificationandPerformanceofElectronicInsulatingCompoundforPrintedBoardAssemblies5-33aRevBAmend110/08RevB8/02RevAAmend17/99RevA10/98Orig.1/84IPC-HDBK-830GuidelinesforDesign,SelectionandApplicationofConformal5-33cRevA8/13Orig.10/02

CoatingsIPC-SM-839PreandPostSolderMaskApplicationCleaningGuidelinesOrig.4/90IPC-SM-840QualificationandPerformanceofPermanentPolymerCoating(SolderMask)forPrintedBoards5-33bRevE12/10RevD4/07RevCAmend16/00RevC1/96RevB5/88RevA7/83Orig.11/77IPC-HDBK-840SolderMaskHandbook5-33dOrig.9/068/83IPC-HDBK-850GuidelinesforDesign,SelectionandApplicationofPottingandEncapsulationMaterialsUsedforElectronicsPrintedCircuitBoardAssembly5-33fOrig.7/12IPC-H-855HybridMicrocircuitDesignGuideObsoletewithoutreplacementOrig.10/82IPC-D-859DesignStandardforThickFilmMultilayerHybridCircuitsOrig.12/89IPC-HM-860SpecificationforMultilayerHybridCircuitsOrig.1/87IPC-TF-870QualificationandPerformanceofPolymerThickFilmPrintedBoardsOrig.11/89IPC-ML-910DesignandEndProductionSpecificationforRigidMultilayerPrintedBoardsD-31b&D-33aSupersededbyIPC-D-949,IPC-D-275,andsubsequentlyIPC-2221forDesignandIPC-ML-950,

IPC-RB-276,andsubsequentlyIPC-6011forEndProductSpecificationRevA8/76Orig.6/68IPC-D-949DesignStandardforRigidMultilayerPrintedBoardsD-31bSupersededbyIPC-D-275andsubsequentlybyIPC-2221/2222Orig.1/87IPC-ML-950PerformanceSpecificationforRigidMultilayerPrintedBoardsD-33aSupersededbyIPC-RB-276andsubsequentlyIPC-6011/6012RevC11/8RevB12/77RevA9/70Orig.1/66IPC-ML-960QualificationandPerformanceSpecificationforMassLaminatedPanelsforMultilayerPrintedBoardsD-33bOrig.7/94IPC-ML-975EndProductDocumentationSpecificationforMultilayerPrintedWiringBoardsSupersededbyIPC-D-325Orig.9/69IPC-ML-990PerformanceSpecificationforFlexibleMultilayerWiringD-33aSupersededbyIPC-6011Orig.9/72IPC-TP-1043Cleaning&CleanlinessTestProgramPhase3WaterSolubleFluxesPart1Orig.8/92IPC-TP-1044Cleaning&CleanlinessOrig.10/92

TestProgramPhase3WaterSolubleFluxesPart2IPC-1065MaterialDeclarationHandbook4-34aOrig.1/05IPC-1066LabelingofPCBsandAssemblies4-34bSupersededbyJ-STD-609Orig.12/04IPC-1071BestIndustryPracticesforIntellectualPropertyProtectioninPrintedBoardManufacturingE-20RevA7/14Orig.1/11IPC-1072IntellectualPropertyProtectioninAssemblyManufacturingE-21Orig.2/16IPC-1081WhitePaperonConflictMineralsDueDiligenceCuidanceE-30Orig.8/15IPC-TP-1090TheLayman'sGuidetoQualifyingNewFluxesforMIL-STD-2000AorMT-0002Orig.7/96IPC-TP-1103ManufacturingConcernsWhenSolderingwithGoldPlatedComponentLeadsorCircuitBoardPadsObsoletewithoutreplacementIPC-TP-1114TheLayman'sGuidetoQualifyingaProcesstoJ-STD-001BOrig.1/98IPC-TP-1115SelectionandImplementationStrategyforALow-ResidueNo-CleanProcessOrig.12/98IPC-1131ITGuidelinesforPWBManufacturers2-20Orig.4/00IPC-1331VoluntarySafetyStandardforElectricallyHeatedProcessEquipmentOrig.3/00

IPC-1601PrintedBoardHandlingandStorageGuidelinesD-35Orig.8/10IPC-1710OEMStandardforPrintedBoardManufacturers'QualificationProfile(MQP)RevA7/0412/97updatedOrig.2/94IPC-1720AssemblyQualificationProfile(AQP)RevA7/04Orig.7/96IPC-1730LaminatorQualificationProfile(LQP)RevA6/00Orig.1/98IPC-1731StrategicRawMaterialsSupplierQualificationProfile3-12iOrig.6/00IPC-1751GenericRequirementsforDeclarationProcessManagement2-18RevAw/Amend112/12RevA2/10Vers.1.13/07Orig.3/06IPC-1752MaterialsDeclarationManagement2-18bRevA.w/Amend1&22/14RevAw/Amend112/12RevA2/10Vers.1.13/07Orig.3/06IPC-1753LaboratoryReportStandard2/18jOrig.2/14IPC-1755ConflictMineralsDataExchangeStandard2-18hAmend14/15Orig.4/14IPC-1756ManufacturingProcessDataManagement2-18aOrig.4/10IPC-1758DeclarationRequirementsforShipping,PackandPackingMaterials2-18fOrig.3/12IPC-2141ControlledImpedanceCircuitBoardsandHighSpeedLogicDesignD-21cRevA3/04Amend12/99Orig.4/9612/09

IPC-2152StandardforDeterminingCurrentCarryingCapacityinPrintedBoardDesign1-10bOrig.8/0902/11IPC-2221GenericStandardonPrintedBoardDesignD-31bRevB11/12RevA5/03Amend11/00Orig.2/98;SupersedesIPC-D-27509/99IPC-2222SectionalDesignStandardforRigidOrganicPrintedBoardsD-31bRevA12/10Orig.2/98;SupersedesIPC-D-275IPC-2223SectionalDesignStandardforFlexiblePrintedBoardsD-11RevC11/11RevB5/08RevA6/04Orig.11/98;SupersedesIPC-D-24909/99IPC-2224SectionalStandardforDesignofPWBsforPCCards1-21Orig.1/98IPC-2225SectionalDesignStandardforOrganicMultichipModules(MCM-L)andMCM-LAssembliesD-31cOrig.5/98IPC-2226DesignStandardforHigh-DensityArrayorPeripheralLeadedComponentMountingStructures1-10Orig.4/0303/09IPC-2251DesignGuidelinesforElectronicPackagingUtilizingHighSpeedTechniquesD-21aOrig.12/0308/09IPC-2252DesignandManufacturingGuideforRF/MicrowaveCircuit