IC代工生產(chǎn)管理培訓(xùn)

MPC教育資料1：什么是PC2：什么是MPC3：MPC需要關(guān)注和解決那些問題4：MPC專業(yè)詞匯解釋第一頁，共五十八頁。什么是PCPC就是productioncontrolPC是著眼在公司層面，根據(jù)銷售訂單以及生產(chǎn)線產(chǎn)能進(jìn)行制定生產(chǎn)投入產(chǎn)出計(jì)劃職責(zé)：產(chǎn)品的投入計(jì)劃確保產(chǎn)品交貨期，以及產(chǎn)出計(jì)劃。確認(rèn)制品MOVE情況以及提醒交貨期會有延遲的產(chǎn)品執(zhí)行客戶需求的產(chǎn)品釋放以及停滯等等第二頁，共五十八頁。什么是MPCMPC的客戶是MPP,MPP客戶是PC。也就是說詳細(xì)的完成PC所下達(dá)的任務(wù)。按生產(chǎn)計(jì)劃檢查、跟蹤并準(zhǔn)確及時(shí)報(bào)告生產(chǎn)流程中的問題。依據(jù)WIP、制品交期、設(shè)備負(fù)荷、制程時(shí)間限制以及在制品及設(shè)備的運(yùn)行狀況等因素調(diào)整實(shí)時(shí)調(diào)度系統(tǒng)的運(yùn)行

提高人員及設(shè)備利用率制品流通率的管理及有關(guān)數(shù)據(jù)的提供依據(jù)生產(chǎn)數(shù)據(jù)計(jì)算生產(chǎn)能力。第三頁，共五十八頁。MPC需要解決哪些問題Themissionofamanufacturingfab:TosatisfycustomerandmaximizethecapacityandwaferoutputWhatcustomerwants?OntimedeliveryGoodwaferqualityLowunitpriceMFGindicesindicatestheperformanceofaFab第四頁，共五十八頁。IndexnameShortdescCTCycleTimeTRTurnRatioMoveWafermovementWIPProductionwaferinprocessEngWIPEngineerwaferinprocessYieldFabYieldHoldHoldWIPTerminateEngineerwaferscrapScrapProductionwaferscrapReworkReworkwaferWSWaferstartWOWaferoutKEY第五頁，共五十八頁。C/T英文全名：Cycle/Time中文全名:運(yùn)轉(zhuǎn)周期定義:theaverageleadtimewhichonewafermustpayforrunning,waiting,holding,andtimeonbankfromwaferstarttoQC-Inspection計(jì)算方式:∑Cycle_Time_Waferi/Wafer_Output

計(jì)算頻率/單位:天指標(biāo)意義:1.考量FAB的硅片的運(yùn)轉(zhuǎn)速度2.衡量FAB的run貨效率第六頁，共五十八頁。TR英文全名：TurnRatioT/R中文全名:在制品周轉(zhuǎn)率定義:Averagenumberofstageswhichonewafercanpenetrateinoneday 每片硅片平均每天跑過的Stage數(shù)計(jì)算方式:StageMove/WIPWIP=(BOH+EOH)/2計(jì)算頻率/單位:每日指標(biāo)意義:1.由TurnRatio可知硅片處理速度是否正常2.此指標(biāo)為StageMove與WIP的比值，因此由此可以得知目前的WIP量是否合理，在制品積壓成本是否過高，以及生產(chǎn)流程是否順暢第七頁，共五十八頁。Move英文全名：WaferMoves中文全名:硅片移動(dòng)量定義:一片硅片完成一個(gè)Stage稱為一個(gè)StageMove;一片硅片完成一個(gè)Step稱為StepMove計(jì)算方式:由Fab中實(shí)際操作的硅片數(shù)加總得到計(jì)算頻率/單位:每日或每月指標(biāo)意義:1.由各個(gè)移動(dòng)量可以了解目前硅片之處理速度是否正常2.由移動(dòng)量預(yù)估硅片是否趕上速度3.籍此衡量各區(qū)域之生產(chǎn)績效第八頁，共五十八頁。WIP英文全名：廣義上Workinprocess在半導(dǎo)體行業(yè):WaferInProcess中文全名:在制品定義:從硅片投入到硅片產(chǎn)出，F(xiàn)ab內(nèi)各站積壓了相當(dāng)數(shù)量的硅片，統(tǒng)稱為Fab內(nèi)的WIP計(jì)算方式:堆積硅片求和計(jì)算頻率/單位:每日或每月/片指標(biāo)意義:衡量一個(gè)FAB的生產(chǎn)能力的標(biāo)志

PWIP:ProductionWIPEngWIP:EngineeringWIP第九頁，共五十八頁。Yield英文全名：Yield中文全名:良率定義:產(chǎn)出硅片良品數(shù)量與投入生產(chǎn)之硅片數(shù)量的比率計(jì)算方式:硅片產(chǎn)出量/（硅片產(chǎn)出量+硅片報(bào)廢量）計(jì)算頻率/單位:每月%指標(biāo)意義:由良率可以顯示所生產(chǎn)硅片之制造環(huán)境，制程，規(guī)格方面之綜合表現(xiàn)，故其為最重要的品質(zhì)指標(biāo)第十頁，共五十八頁。英文全名:Hold中文全名:硅片擱置定義:在生產(chǎn)過程中因?yàn)榭刂苹蛘吖こ淘驎簳r(shí)無法進(jìn)行生產(chǎn)的硅片數(shù)量計(jì)算方式:所有holdWIP數(shù)量相加計(jì)算頻率/單位:每日或每月片指標(biāo)意義:1.衡量工廠生產(chǎn)穩(wěn)定度 2.衡量因工程原因?qū)ιa(chǎn)周期的影響Hold第十一頁，共五十八頁。Terminate/Scrap英文全名：Scrap中文全名:報(bào)廢硅片定義:totalwaferscrapquantityinFAB計(jì)算方式:所有Scrap求和計(jì)算頻率/單位:每日或每月片指標(biāo)意義:1.衡量制程穩(wěn)定度2.衡量一個(gè)FAB的生產(chǎn)良率 3.EngWIPterminate用以衡量工廠研發(fā)或者保持制程穩(wěn)定而用掉的cost第十二頁，共五十八頁。Rework英文全名:Rework中文全名:返工定義:TotalreworkcountinFablithoarea計(jì)算方式:所有rework數(shù)目累加計(jì)算頻率/單位:每日或每月片指標(biāo)意義:1.衡量Litho制程穩(wěn)定度2.衡量litho無效movement數(shù)量第十三頁，共五十八頁。WS英文全名:Waferstart中文全名:硅片下線定義:Totalwaferstartcount計(jì)算方式:所有下線數(shù)目累加計(jì)算頻率/單位:每日或每月片指標(biāo)意義:衡量工廠生產(chǎn)規(guī)模第十四頁，共五十八頁。WO英文全名:Waferout中文全名:硅片出貨定義:Totalwaferoutcount計(jì)算方式:所有出貨數(shù)目累加計(jì)算頻率/單位:每日或每月片指標(biāo)意義:衡量工廠生產(chǎn)規(guī)模第十五頁，共五十八頁。MFGindicesintroductionWhatisa“Golden”Fab第十六頁，共五十八頁。MPC需要關(guān)注哪些問題WaferMovesWaferStepMoveLocationMoveWaferInProcess(WIP)EndOnHand&BeginOnHandTurnRatio(T/R)-DailyEquipmentUPTimeWaferPerHour(WPH)EquipmentEfficiencyUtilizationManufacturingEfficiencyCycleTimePerMaskLayer(C/T)WaferOutLineYieldWaferAcceptanceTest(WAT)FabYield第十七頁，共五十八頁。WaferMovesDefinitionWaferstepMove=1wafermovingfromoneSteptoanother.WaferstageMove=1wafermovingfromonestagetoanother.MethodofCalculationSumofactualfaborsectionwaferstagemovestogivefabwafersmove,andsectionwafersmoverespectively.PurposeofWaferMoveIndexFrompresentamountofwafermoves,wecandetermineifthepresentproductionrateofthesectionorfabisnormal.Useasameasurementindextocompareshifttoshiftorfabtofab第十八頁，共五十八頁。SampleCalculationsScenario1: Particularlotof25waferscompleted4stages onthe1stofFebruary2000.Scenario2: Particularlotof25waferscompleted70 stagesinthemonthofJanuary2000.Scenario1Moves: Onthe1stofFebruary2000,Wafer Move =25X4 =100Scenario2Moves: InthemonthofJanuary2000,Wafer Move =25x70 =1750第十九頁，共五十八頁。WaferStepMoveDefinitionWaferSTEPMove-1wafermovingfromonesteptoanother.(Note:1Stepisequivalentto1equipmentmoveor1metrologystep.)MethodofCalculationSumofactualfab,sectionorequipmentwaferSTEPmovestogivefabwafersmove,sectionwafersmoveandequipmentwafermovesrespectively.PurposeofWaferStepMoveIndexFrompresentamountofwafermoves,wecandetermineifthepresentproductionrateoftheequipmentorsectionisnormal.Useasameasurementindextocompareequipmenttoequipmentorperformanceofoperatortooperator.第二十頁，共五十八頁。SampleCalculationsScenario1: Particularlotof25waferscompleted6steps onthe1stofFebruary2000.Scenario1StepMoves: Onthe1stofFebruary2000, WaferMove =25X6 =150StepMoves(Assumingtheaveragenumberofstepsperstages3steps/stage)StageMoveson1stofFebruary2000=150/3 =50StageMoves第二十一頁，共五十八頁。LocationMoveDefinitionTotalnumberofWaferStageMove–1wafermovingfromonestagetoanother.MethodofCalculationSumofstagemoveswithinprocessarea(CVD,PVD,PHOTO,etc).PurposeofLocationMoveIndexFrompresentamountofwafermoves,wecandetermineifthepresentproductionrateoftheprocessareaisnormal.Useasameasurementindextocomparedaytodayormonthtomonthperformanceofaprocessarea.第二十二頁，共五十八頁。SampleCalculationsScenario1: WaferMoveintheCVDareaforIMD=1200, PETEOS=800,SACVD=500,HDP=400 andBPTEOS=400.Scenario1LocatonMoves:CVDLocationMoves =1,200+ 800+500+400+400 =3,000Moves第二十三頁，共五十八頁。Wafer

InProcess(WIP)DefinitionNumberofwafersperstep,stage,section,shiftorfab.(ierunning,wait,hold,etc)MethodofCalculationSumofallwafersinthatstep,stage,section,shiftorfabrespectively.PurposeofWorkInProcessIndexFrompresentamountofwafermoves,wecandetermineifthepresentcapacityoftheequipment,sectionorfabissufficient.Useasanindicatortopossiblebottleneckinthefab.MovementoftheWIPindexwillreflectthestabilityoftheequipment/processandatthesametimethecapability(constraints)oftheequipment.第二十四頁，共五十八頁。EndOnHand&BeginOnHand(1)DefinitionEOH-WIPperstage,sectionorshiftorfabattheENDofashift.BOH-WIPperstage,sectionorshiftorfabattheSTARTofashift.MethodofCalculationSumofallwafersinthatstage,section,shiftorfabrespectivelyattheendorstartofashift.第二十五頁，共五十八頁。EndOnHand&BeginOnHand(2)PurposeofEOHandBOHIndexBycomparingtheEOHandtheBOHofashift,wecanhaveafeeloftheperformanceoftheequipmentandtheshift.AnincreaseinWIPfromtheBOHtoEOHmayindicatepoorequipmentstatusinthedifferentfabsorsectionsorshifts,orpoordispatchingskilloftheshiftiftheequipmentstatusisnormal.第二十六頁，共五十八頁。TurnRatio(T/R)-Daily(1)DefinitionNumberofstagescompletedbyeachwaferperday.MethodofCalculationT/R=TotalStageMovesPerDay/AverageWIP(Note:AverageWIPperday=[BOH+EOH]/2)第二十七頁，共五十八頁。TurnRatio(T/R)-Daily(2)PurposeofTurnRatioIndexFromtheT/Rwecandetermineifthecurrentwaferproductionrateisnormalortooslow.AsthisindicatortakestheratioofStagemovestoAverageWIP,thereforewecoulddetermineif:CurrentWIPisreasonablerelativetobenchmarkedquantity.IsthecostofWIP(inventory)relativetothecostofequipmentlosttimeproportional.CurrentproductionflowissmoothwithnobottleneckIsthestagetargetrealistic.第二十八頁，共五十八頁。SampleCalculationsScenario1: Onthe1stofFebruary2000,TotalStageMove(CVD)is10,000,theBOHWIPonthatdayis5,500andEOHWIPonthatdayis6,000.Scenario1T/R: Onthe1stofFebruary2000, T/R =10,000/[(5,500+6,000)/2] =1.74(Note:AnaverageT/Rof2.1to2.2isreasonableforafab)第二十九頁，共五十八頁。EquipmentUPTime(1)DefinitionTimewhenequipmentisfit-for-production.MethodofCalculationUPTime=RunTime+LostTime+TestTime+BackupTimePurposeofUPTimeIndexFromtheUPTimewecandeterminethetotalamountoftimeavailableforproduction.TheratioofLostTimetoAvailableTimeisusedtodeterminetheroomforimprovementintermsofutilizationforaparticularequipment.第三十頁，共五十八頁。EquipmentUPTime(2)第三十一頁，共五十八頁。SampleCalculationsScenario1: InFebruary2000,RunTime=700hours,Lost Time=100hours,TestTime=100hours, andBackupTime=50hoursforWCVD equipment.Scenario1WCVDAvailableTime: InFebruary2000, AvailTime =950hours LostRate =100/950 =10.5%第三十二頁，共五十八頁。WaferPerHour(WPH)(1)DefinitionNumberofwafersprocessedperhour.MethodofCalculationWPH=WaferMove/RunTimePurposeofWaferPerHour(WPH)Index(1)FromthepresentequipmentWPHwecandeterminewhetherthecurrentequipmentrateofproductiontotalisnormal.TheequipmentWPHcanbeusedtoderivetheequipmentcapacity,whichcanbeinturnusedtodetermineifthetotalcapacityforaparticularcapabilityissufficient.第三十三頁，共五十八頁。WaferPerHour(WPH)(2)PurposeofWaferPerHour(WPH)Index(2)TheratioofthecurrentequipmentWPHtotheTheoretical–WPH(T–WPH)canbeusedtodetermineiftheequipmentispresentlyoperatingintheoptimumconditions.WPHindexcanalsobeusedtomeasureindividualMAorshiftperformance,especiallysoinmanualoperations.RelativeWPHbetweenequipmentrunningthesamerecipecanbeusedtodeterminetheindividualequipment第三十四頁，共五十八頁。SampleCalculations(1)Scenario1: On1stofFebruary2000,RunTime=20hours andWaferMoves=1700wafersforWCVD equipment.Scenario2: Thesameequipmentforthemonthof February2000,RunTime=600hoursand thetotalWaferMoves=54,000wafers.Scenario3: RunTime=12hours,WaferMovesby OperatorA=500andOperatorB=400on thesameequipment.第三十五頁，共五十八頁。SampleCalculations(2)Scenario1WCVDWPH: On1stofFebruary2000, WPH=1,700/20 =85wafers/hourScenario2WCVDWPH: InthemonthofFebruary2000, WPH=54,000/600 =90wafers/hourTherefore,wecansaythatthecurrentequipmentrateofproductionislowerthantheaverageforthewholemonth.Scenario3: OperatorAhasaWPH=500/12 =41.67wafers/hour OperatorBhasaWPH=400/12 =33.33wafers/hour第三十六頁，共五十八頁。EquipmentEfficiency(1)DefinitionPercentageoftheactualwafermovesperhourtotheidealwafermovesperhour.MethodofCalculationEquipmentEfficiency =[(TotalActualWaferMoves/TotalRunTime)/(Average IdealWPH)]X100%Note:Asthe“IdealWPH”isdependentontherecipeofthelotprocessed,the“AverageIdealWPH”isthesumofthe“IdealWPH”multiplebytheproportionofthenumberoflots(duringtheperiodoftime)withthatrecipedividedbytheTotalRunTime.

第三十七頁，共五十八頁。EquipmentEfficiency(2)PurposeofEquipmentEfficiencyIndexTheequipmentefficiencyindexshowhowmuchdeviationfromtheoptimumperformanceistheequipmentbeingoperatedin.Determineifthereisanyweakness/abnormalitywithanequipmentcapabilities/fabWIPprofile/processcapability.Baseontheefficiencyoftheequipment,weareabletolookintomethodstooptimizetheequipmentandincreasethethroughputoftheequipment.第三十八頁，共五十八頁。ExamplesExampleofsomesituationsthatLOWERStheequipmentefficiency:Only1SMIFArmisinworkingcondition.Takesalongertimethanusualtoachieverequiredvacuumfortheloadlock–equipmentproblem.SMIFArmunabletounloadautomaticallythereforestatusremains“Run”(RunTimeincreaseswithoutincreaseinoutput)evenwhenwafersalreadycompleteditsprocess.Thebottleneckchamberoftheequipmentisdownandthereforetheimpactdeductedislessthantheactualimpact.Timerequireforachievingvacuumisthesameforalotwith25wafersandonewithonly1wafer.Thereforethetimeperwaferisincreasesignificantlywhenlotwithonly1waferisprocessed.第三十九頁，共五十八頁。SampleCalculationsScenario1: On1stofFebruary2000,shiftA,WCVD equipment,WaferMoves=375wafers,Run Time=12hours.Thelotsconsistof5lotsof recipeAand10lotsofrecipeB.RecipeA: IdealWPH=30,RecipeB:IdealWPH=45.Scenario1Efficiency:AverageIdeaWPH =(5/15 X30)+(10/15X45) =40waferperhourEquipmentEfficiency=(375/12)/(40)X100 =78.13%第四十頁，共五十八頁。Utilization(1)DefinitionTheamountoftimedemandedofanequipmentforproduction,versusthetotalamountoftimeavailable.Demand/CapacityMethodofCalculationUtilization=(RunTime+TestTime+BackUpTime)/Total TimeX100%第四十一頁，共五十八頁。Utilization(2)PurposeofUtilizationIndexForaUtilizationIndexgreaterthan100%forcertainequipment,wecansafelysaythatthepresentequipmentcapacityisnotsufficientforthepresentdemand.Iftheutilizationislowforcertainequipment,buttheWIPishigh,itcouldbeduetotheequipmentnothavingthecapabilitytoruntherecipesrequiredbytheWIP.第四十二頁，共五十八頁。SampleCalculationsScenario1: Inaday(24hours),WCVDequipmenthas RunTime=12hoursandBackUpTime=6 hours.Scenario1Utilization:Utilization =(12+6)/24X100% =75%第四十三頁，共五十八頁。ManufacturingEfficiency(1)DefinitionPercentageoftheequipmentavailabletimeusedforproduction(RunTime,TestTimeandBackUpTime)overthetotalequipmentavailabletime(RunTime,TestTime,LostTimeandBackUpTime).MethodofCalculationManufacturingEfficiency=(Utilization/Availability)X100%第四十四頁，共五十八頁。ManufacturingEfficiency(2)PurposeofManufacturingEfficiencyIndexThemanufacturingefficiencyindexcomparestheperformanceoftheoperatorunderahighWIPsituation.Thehighertheefficiencyindexthebettertheperformance.OneoftheindicatorsforlowWIPforspecificequipment,sectionorfab.AhighWIPandlowmanufacturingefficiencyindexcouldbeduetoequipmentconstraintanditscapabilities.第四十五頁，共五十八頁。SampleCalculationsScenario1: OperatorA’sequipmenthasRunTime=8 hours,TestTime=1hour,BackUpTime=0 andLostTime=3hours.Scenario1OperatorA:ManufacturingEfficiency =(8+1+0)/(8+1+0+3)X100%=75%第四十六頁，共五十八頁。CycleTimePerMaskLayer(C/T)(1)DefinitionAveragenumberofdaysrequiredforprocessingbetweentwophotostages.(1layers.onephotostagetoanother)Aseachindividuallayerisdefinedbyaphotostage,thereforethenumberoflayersofaproductisequivalenttothenumberofphotostages.Note:For0.25microntechnology,thereisanaverageof25layers.MethodofCalculationC/T=(TimewhichwaferpassestheQCtest–Timeatwaferstart)/Numberofphotostages.第四十七頁，共五十八頁。CycleTimePerMaskLayer(C/T)(2)PurposeofWaferMoveIndexBaseonthenumberoflayersoftheproduct,andtheuseoftheaveragecycletimeofthefab,weareabletodeterminetheaveragetimerequiredfortheproductfromstarttocompletion.Thereby,enablingustodecideonthedatefortheproductwaferstartinordertomeetthedeliveryschedule.第四十八頁，共五十八頁。SampleCalculationsScenario1: Aparticularproducthas16layers,andthe timerequiredfromwaferstarttillQCtestingis 40days.Scenario1C/Tperlayer: C/Tperlayer =40/16 =2.5daysperlayer第四十九頁，共五十八頁。WaferOutDefinitionTotalquantityofwafersthatpassestheQCtest.MethodofCalculationProductionController(PC)willannouncedtheofficialWaferOutquantity.PurposeofWaferOutIndexTheWaferOutIndexwillindicatethefaboutputstatus.第五十頁，共五十八頁。SampleCalculationsScenario1: InthemonthofFebruary2000,quantityof wafersthatpassesQCtest=15,000wafers.Scenario1WaferOut: InthemonthofFebruary2000 WaferOut=15,000wafers第五十一頁，共五十八頁。LineYieldDefinitionPercentageofwafersproducedbythefabpriortoWAT.MethodofCalculation LineYield=(QuantityofWaferProduced)/[(Quantityof WaferProduced)+(QuantityofWafer ScrappedintheProductionProcess)] =(QuantityofWaferProduced)/(Quantityof RawWaferUsedforProduction)PurposeofLineYieldIndexTheLineYieldreflectsthequalityofthemanufacturingsystemofafab.ThehighertheLineYieldthelessermisoperationswithinthefab.第五十二頁，共五十八頁。S